[1]栗慧.钎焊氮化硅陶瓷的Cu基钎料的研究进展[J].常州工学院学报,2014,(自科01):13-18.[doi:10.3969/j.issn.1671-0436.2014.01.005]
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钎焊氮化硅陶瓷的Cu基钎料的研究进展
常州工学院学报[ISSN:/CN:]
- 卷:
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- 期数:
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2014年自科01
- 页码:
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13-18
- 栏目:
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自科版
- 出版日期:
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2014-02-20
文章信息/Info
- Title:
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Research Progress of Cu-base Brazing Filler Metals for Brazing Silicon Nitride Ceramics
- 作者:
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栗慧
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常州工学院机电工程学院,江苏 常州 213002
- Author(s):
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- 关键词:
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陶瓷连接; Si3 N4 陶瓷; Cu基钎料
- Keywords:
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joining of ceramic; silicon nitride; Cu-base brazing filler metal
- 分类号:
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TG42
- DOI:
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10.3969/j.issn.1671-0436.2014.01.005
- 文献标志码:
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A
- 摘要:
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陶瓷连接技术是结构陶瓷实用化的有效手段,焊料成分对连接体的性能具有决定性作用。文章主要从焊料成分的角度,重点总结了钎焊Si3 N4陶瓷的Cu基钎焊材料的发展现状。
- Abstract:
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Joining technology of silicon nitride based materials is the most effective means for practical application.The chemical composition of adhesive has significant influence on the joining strength.The re-cent development in brazing of Si3 N4 ceramics Cu-base brazing fillers is emphatically reviewed in this paper from the point of chemical composition.
更新日期/Last Update:
2014-02-28