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[1]栗慧.钎焊氮化硅陶瓷的Cu基钎料的研究进展[J].常州工学院学报,2014,(自科01):13-18.[doi:10.3969/j.issn.1671-0436.2014.01.005]
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钎焊氮化硅陶瓷的Cu基钎料的研究进展
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常州工学院学报[ISSN:/CN:]

卷:
期数:
2014年自科01
页码:
13-18
栏目:
    自科版
出版日期:
2014-02-20

文章信息/Info

Title:
Research Progress of Cu-base Brazing Filler Metals for Brazing Silicon Nitride Ceramics
作者:
栗慧
常州工学院机电工程学院,江苏 常州 213002
Author(s):
-
关键词:
陶瓷连接Si3 N4 陶瓷Cu基钎料
Keywords:
joining of ceramicsilicon nitride Cu-base brazing filler metal
分类号:
TG42
DOI:
10.3969/j.issn.1671-0436.2014.01.005
文献标志码:
A
摘要:
陶瓷连接技术是结构陶瓷实用化的有效手段,焊料成分对连接体的性能具有决定性作用。文章主要从焊料成分的角度,重点总结了钎焊Si3 N4陶瓷的Cu基钎焊材料的发展现状。
Abstract:
Joining technology of silicon nitride based materials is the most effective means for practical application.The chemical composition of adhesive has significant influence on the joining strength.The re-cent development in brazing of Si3 N4 ceramics Cu-base brazing fillers is emphatically reviewed in this paper from the point of chemical composition.

参考文献/References:

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备注/Memo

备注/Memo:
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更新日期/Last Update: 2014-02-28